SAMSUNG MALAYSIA ELECTRONICS (SME) SDN. BHD.

LEI: 2549004PSLMREKN58L14
Malaysia
Last updated: Jun 10, 2026
ACTIVEISSUED

Entity Information

Legal Entity Identifier (LEI)
2549004PSLMREKN58L14
Registration ID
200301026766 (629186-D)(ID: RA000439)
Legal Form
XEOV
Jurisdiction
Malaysia
Legal address country
Malaysia

Entity Names

Legal Name

SAMSUNG MALAYSIA ELECTRONICS (SME) SDN. BHD.(Language: ms)

Addresses

Legal Address

12TH FLOOR, MENARA SYMPHONY
NO. 5, JALAN PROF. KHOO KAY KIM
SEKSYEN 13
PETALING JAYA, MY-10, 46200, Malaysia

Loading map...

Headquarters Address

삼성로 129 (매탄동) 삼성전자
수원시 영통구, KR-41, 16677, South Korea

Loading map...

Additional Information

Entity Status

Current Status

ACTIVE

Need to maintain compliance?

LEIs must be renewed annually to keep your entity's information up to date

Renew this LEI

Reference Guide

LEI status meaning

This LEI is issued, which usually means the registration is active and suitable for current reference and compliance checks.

Renewal date

The next renewal date is June 10, 2027. This is the key deadline for keeping the LEI record current.

Jurisdiction

SAMSUNG MALAYSIA ELECTRONICS (SME) SDN. BHD. is registered under jurisdiction MY. Match that jurisdiction with the legal address and local registration number before relying on the LEI.

Parent and ultimate parent

Direct parent is linked to LEI 9884007ER46L6N7EI764, with relationship status active. Ultimate parent is linked to LEI 9884007ER46L6N7EI764, with relationship status active.

How to verify this entity

  1. •Match the legal name "SAMSUNG MALAYSIA ELECTRONICS (SME) SDN. BHD." to the entity you expect.
  2. •Check local registration number 200301026766 (629186-D) against authority RA000439.
  3. •Confirm the validation source RA000439 and reference 200301026766 (629186-D).

LEI Verified Badge

Display your verified LEI status on your website with our free badge widget

Get Your Badge Code

Click "Show Code" to view the HTML code for your LEI Verified badge

Entity & LEI Status Summary

This Legal Entity Identifier (LEI) record pertains to SAMSUNG MALAYSIA ELECTRONICS (SME) SDN. BHD., identified by the LEI 2549004PSLMREKN58L14. The entity is formally registered under the jurisdiction of Malaysia (via RA000439, registered as 200301026766 (629186-D)) and lists its legal address country as Malaysia. It operates under the legal structure defined as "XEOV", classified under the category "GENERAL".

The current operational status of the entity is reported as "ACTIVE". The LEI registration itself is currently "ISSUED", managed by the Local Operating Unit (LOU) 5493001KJTIIGC8Y1R12. Key dates associated with this registration include its initial establishment on Jun 10, 2026, its most recent update on Jun 10, 2026, and a scheduled renewal date of Jun 10, 2027.

Maintaining an active and up-to-date LEI is crucial for SAMSUNG MALAYSIA ELECTRONICS (SME) SDN. BHD. to ensure continuous participation in global financial markets and regulatory reporting. The corroboration level for this record is "FULLY_CORROBORATED", indicating the extent to which the information has been verified against official registers. The primary validation of this information was performed by RA000439 (as 200301026766 (629186-D)).

Registration Details

Timeline

  • Initial Registration
    Jun 10, 2026
  • Last Updated
    Jun 10, 2026
  • Next Renewal
    Jun 10, 2027

Validation

Primary Validation

Authority ID
RA000439
Registration Number
200301026766 (629186-D)

Status Information

Registration Status
ISSUED
Corroboration Level
FULLY_CORROBORATED

Managing Authority

Local Operating Unit (LOU)
5493001KJTIIGC8Y1R12

Corporate Structure

Direct Parent

Parent Entity

LEI: 9884007ER46L6N7EI764

Relationship: IS DIRECTLY CONSOLIDATED BYStatus: ACTIVE
View Details

Ultimate Parent

Ultimate Parent Entity

LEI: 9884007ER46L6N7EI764

Relationship: IS ULTIMATELY CONSOLIDATED BYStatus: ACTIVE
View Details

Corporate Structure Visualization

Direct & Ultimate Parent
LEI: 9884007ER46L6N7EI764
View Details
SAMSUNG R&D INSTITUTE INDIA - BANGALORE PRIVATE LIMITED
LEI: 335800SRXP1QFLODA627
View Details
삼성디스플레이(주)
LEI: 9884004ARY4RODDUCT12
View Details
SAMSUNG ELETRONICA DA AMAZONIA LTDA
LEI: 391200ZUV0OBZ6DXZ251
View Details
哈曼(中国)投资有限公司
LEI: 549300FFG1SSEGJR6H60
View Details
HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
LEI: 1VWDHRIRERCQ5D5M5681
View Details
Siblings
SAMSUNG MALAYSIA ELECTRONICS (SME) SDN. BHD.
LEI: 2549004PSLMREKN58L14
Legend:
Current Entity
Parent Entity
Child Entity
Sibling Entity
Owned by / Child of
Owns / Parent of
Exception Reported

Relationship overview showing parent, sibling, and child entities linked to this LEI.

Child Entities

No child entities found