哈曼(中国)投资有限公司

LEI: 549300FFG1SSEGJR6H60
China
Last updated: Aug 5, 2025
ACTIVELAPSED

Entity Information

Legal Entity Identifier (LEI)
549300FFG1SSEGJR6H60
Registration ID
91310000690161476B(ID: RA000092)
Legal Form
8888(COMPANY LIMITED)
Jurisdiction
China
Legal address country
China

Entity Names

Legal Name

哈曼(中国)投资有限公司(Language: zh)

Other Names

  • HARMAN INTERNATIONAL (CHINA) HOLDINGS CO., LTD.(Language: en)

Addresses

Legal Address

CHONG HING FINANCE CENTER
288 NANJING WEST ROAD SUITE 3004
SHANGHAI, CN-SH, 200003, China

Loading map...

Headquarters Address

CHONG HING FINANCE CENTER
288 NANJING WEST ROAD SUITE 3004
SHANGHAI, CN-SH, 200003, China

Loading map...

Additional Information

Entity Status

Current Status

ACTIVE

Need to maintain compliance?

LEIs must be renewed annually to keep your entity's information up to date

Renew this LEI

Reference Guide

LEI status meaning

This LEI still exists in the registry, but the annual renewal is overdue, so the reference data may no longer be current.

Renewal date

The listed renewal date was November 30, 2022. That date has passed, so this record should be rechecked before use in a compliance workflow.

Jurisdiction

哈曼(中国)投资有限公司 is registered under jurisdiction CN. Match that jurisdiction with the legal address and local registration number before relying on the LEI.

Parent and ultimate parent

Direct parent is linked to LEI 9884007ER46L6N7EI764, with relationship status active. Ultimate parent is linked to LEI 9884007ER46L6N7EI764, with relationship status active.

LEI Verified Badge

The LEI Verified badge is only available for entities with active or issued LEI status.

Registration status: LAPSED

Entity & LEI Status Summary

This Legal Entity Identifier (LEI) record pertains to 哈曼(中国)投资有限公司, identified by the LEI 549300FFG1SSEGJR6H60. The entity is formally registered under the jurisdiction of China (via RA000092, registered as 91310000690161476B) and lists its legal address country as China. It operates under the legal structure defined as "8888 (COMPANY LIMITED)", classified under the category "GENERAL".

The current operational status of the entity is reported as "ACTIVE". The LEI registration itself is currently "LAPSED", managed by the Local Operating Unit (LOU) 213800WAVVOPS85N2205. Key dates associated with this registration include its initial establishment on Oct 30, 2013, its most recent update on Aug 5, 2025, and a scheduled renewal date of Nov 30, 2022.

Maintaining an active and up-to-date LEI is crucial for 哈曼(中国)投资有限公司 to ensure continuous participation in global financial markets and regulatory reporting. The corroboration level for this record is "FULLY_CORROBORATED", indicating the extent to which the information has been verified against official registers. The primary validation of this information was performed by RA000092 (as 91310000690161476B).

Registration Details

Timeline

  • Initial Registration
    Oct 30, 2013
  • Last Updated
    Aug 5, 2025
  • Next Renewal
    Nov 30, 2022

Validation

Primary Validation

Authority ID
RA000092
Registration Number
91310000690161476B

Status Information

Registration Status
LAPSED
Corroboration Level
FULLY_CORROBORATED

Managing Authority

Local Operating Unit (LOU)
213800WAVVOPS85N2205

Corporate Structure

Direct Parent

Parent Entity

LEI: 9884007ER46L6N7EI764

Relationship: IS DIRECTLY CONSOLIDATED BYStatus: ACTIVE
View Details

Ultimate Parent

Ultimate Parent Entity

LEI: 9884007ER46L6N7EI764

Relationship: IS ULTIMATELY CONSOLIDATED BYStatus: ACTIVE
View Details

Corporate Structure Visualization

Direct & Ultimate Parent
LEI: 9884007ER46L6N7EI764
View Details
SAMSUNG MALAYSIA ELECTRONICS (SME) SDN. BHD.
LEI: 2549004PSLMREKN58L14
View Details
SAMSUNG R&D INSTITUTE INDIA - BANGALORE PRIVATE LIMITED
LEI: 335800SRXP1QFLODA627
View Details
삼성디스플레이(주)
LEI: 9884004ARY4RODDUCT12
View Details
SAMSUNG ELETRONICA DA AMAZONIA LTDA
LEI: 391200ZUV0OBZ6DXZ251
View Details
HARMAN INTERNATIONAL INDUSTRIES, INCORPORATED
LEI: 1VWDHRIRERCQ5D5M5681
View Details
Siblings
哈曼(中国)投资有限公司
LEI: 549300FFG1SSEGJR6H60
哈曼(中国)科技有限公司
LEI: 549300QRHBJOBZB6M863
View Details
HARMAN TECHNOLOGY (SHENZHEN) CO., LTD.
LEI: 549300WQ4M8JM6R1BC90
View Details
Legend:
Current Entity
Parent Entity
Child Entity
Sibling Entity
Owned by / Child of
Owns / Parent of
Exception Reported

Relationship overview showing parent, sibling, and child entities linked to this LEI.

Child Entities

哈曼(中国)科技有限公司

LEI: 549300QRHBJOBZB6M863

View Details

HARMAN TECHNOLOGY (SHENZHEN) CO., LTD.

LEI: 549300WQ4M8JM6R1BC90

View Details