Entity Information
- Legal Entity Identifier (LEI)
- 549300ZFFY4BYGZ1AX14
- Registration ID
- 202001040513 (1396834-X)(ID: RA000439)
- Legal Form
- XEOV
- Jurisdiction
Malaysia- Legal address country
- Malaysia
Entity Names
Legal Name
ASSEMBLY PAYMENTS MALAYSIA SDN. BHD.(Language: ms)
Addresses
Legal Address
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Headquarters Address
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Additional Information
Entity Status
Current Status
ACTIVENeed to maintain compliance?
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LEI status meaning
This LEI is issued, which usually means the registration is active and suitable for current reference and compliance checks.
Renewal date
The next renewal date is October 27, 2026. This is the key deadline for keeping the LEI record current.
Jurisdiction
ASSEMBLY PAYMENTS MALAYSIA SDN. BHD. is registered under jurisdiction MY. Match that jurisdiction with the legal address and local registration number before relying on the LEI.
Parent and ultimate parent
Direct parent is linked to LEI 5493008W0KUEW1VX6696, with relationship status active. Ultimate parent is linked to LEI U4LOSYZ7YG4W3S5F2G91, with relationship status active.
How to verify this entity
- •Match the legal name "ASSEMBLY PAYMENTS MALAYSIA SDN. BHD." to the entity you expect.
- •Check local registration number 202001040513 (1396834-X) against authority RA000439.
- •Confirm the validation source RA000439 and reference 202001040513 (1396834-X).
Related links
- Sibling entity: ASSEMBLY PAYMENTS INDIA PRIVATE LIMITED
- Sibling entity: ASSEMBLY PAYMENTS HK LIMITED
- Sibling entity: ASSEMBLY ESCROW INC.
- Sibling entity: ASSEMBLY PAYMENTS INC.
- Direct parent: ASSEMBLY PAYMENTS PTE. LTD.
- Ultimate parent: STANDARD CHARTERED PLC
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Entity & LEI Status Summary
This Legal Entity Identifier (LEI) record pertains to ASSEMBLY PAYMENTS MALAYSIA SDN. BHD., identified by the LEI 549300ZFFY4BYGZ1AX14. The entity is formally registered under the jurisdiction of Malaysia (via RA000439, registered as 202001040513 (1396834-X)) and lists its legal address country as Malaysia. It operates under the legal structure defined as "XEOV", classified under the category "GENERAL".
The current operational status of the entity is reported as "ACTIVE". The LEI registration itself is currently "ISSUED", managed by the Local Operating Unit (LOU) 213800WAVVOPS85N2205. Key dates associated with this registration include its initial establishment on Nov 1, 2021, its most recent update on Sep 1, 2025, and a scheduled renewal date of Oct 27, 2026.
Maintaining an active and up-to-date LEI is crucial for ASSEMBLY PAYMENTS MALAYSIA SDN. BHD. to ensure continuous participation in global financial markets and regulatory reporting. The corroboration level for this record is "PARTIALLY_CORROBORATED", indicating the extent to which the information has been verified against official registers. The primary validation of this information was performed by RA000439 (as 202001040513 (1396834-X)).
Registration Details
Timeline
- Initial Registration
- Nov 1, 2021
- Last Updated
- Sep 1, 2025
- Next Renewal
- Oct 27, 2026
Validation
Primary Validation
- Authority ID
- RA000439
- Registration Number
- 202001040513 (1396834-X)
Status Information
Managing Authority
Corporate Structure
Direct Parent
Parent Entity
LEI: 5493008W0KUEW1VX6696
Ultimate Parent
Ultimate Parent Entity
LEI: U4LOSYZ7YG4W3S5F2G91
Corporate Structure Visualization
Relationship overview showing parent, sibling, and child entities linked to this LEI.
Child Entities
No child entities found